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MV-2TH
MV-3

Desktop AOI Machine is designed to automatically inspect component placement and solder bridge after reflow. Overall process improvement is gained when using the SPC feature to track and eliminate defects found on previously inspected assemblies.

Features and benefits

1.Corresponds well to the color changes of parts by using color Cameras
2.Using high resolution camera allows inspection for 0603 mm Chip / 0.4 pitch IC (Option)
3.OCR engine has the ability to recognize any font, reducing the number of false
srrors (Feature Extraction Method, Statistical Recognition Method, Register/Delete font by operator)
4.Superior inspection speed and accuracy with single camera to 2 FOV
5.Excellent Solder inspection by using special light system
6.Superior inspection capability by adapting exclusive algorithms for each component

MV-5

Non-vibration In-Line Machine (MV-5) is made to automatically inspect component placement after chip mounter. It is an economical secondary Inspection Machine for hight Complex and Speedy Production Line. .

Features and benefits

1.In-Line AOI machine
2.Fast and Silent inspection with No X-Y robot
3.Patent pending reflection mirrors technology
4.Add up on the production line without change of line configuration
5.Increased productivity by inspecting multiple PCBs'
6.ATT (Auto Teaching Tool) creates programmed locations using pick and place data
7.Overall process improvement by using SPC

MV-7

In-Line AOI Machine (MV-7 Series)is made to automatically inspest component placement and solder bridge after reflow.
Simple but powerful inspection will eliminate defects on your products.

Features and benefits

1.Exclusive inspection windows for each component type
2.Corresponds well to industry's ultra small component
3.User selective Camera resolution
4.Net work based server application for SPC and Repair
5.Increased productivity by inspecting multiple PCB's
6.Accelerated teaching time by using ATT (Auto Teaching Tool)
7.Adapted NG Marking system

MX-9

MX-9 is an inspection machine which can be used to inspect soldering defects of BGA and CSP using X-ray in the SMT production after reflow process manually or automatically.

Features and benefits

1.Automatic inspection by application of teaching information
2.Real time X-ray inspection
3.Application of 100 kV X-ray tube
4.Acquisition of clear image by adoption of Micro Focal Spot (5 ) X-ray tube
5.Convenient and Friendly User Interface
6.Automatic Feeding Function of teaching position
7.Handling various images
8.Editing function of sample component image and documentation function