Features:
Thin Flexible Circuit Board Materials with a Low modulus polyimide
Excellent Dimension stability
Excellent Flexibility and Heat resistance
Halogen-free
Applications:
Smartphone, casing edge, slide keyboard, DSCs, etc.
RF-705 LCP
Features:
Excellent high frequency characteristics
Excellent Dimension stability
Excellent peel strength
UL94VTM-0 flame resistance
Applications:
Smartphone (FPC Antena, LCD module), Note PC, Tablet PC, High-speed FPC Cable
Megtron 6
Features:
Low Dk=3.6 Df=0.002. (2GHz)
Low thermal expansion Low Z-CTE=45ppm/C.
Low transmission loss.
High through-hole connection reliability.
Meeting lead-free solder requirement 288C, solder flaot, 6 times : ok
Applications:
Network equipment, Mainframe, IC Tester, High frequency measuring device, etc.
Megtron 4:
Features:
Low Dk=3.8 Df=0.005(1GHz).
High heat resistance. Thermal decomposition temperature about 50C higher than High Tg FR4
Excellent solder heat resistance. Compatible with lead-free soldering.
Excellent filling ability of IVH
Applications:
Network equipment(server routers), measuring instruments, etc.