EMD’s ultimate goal is continued to increase its products and service offerings the highest value
solution available in fulfilling our mission of “creating the Future”.In response to the future development
trend of electronic products becoming smaller and lighter, as well as the pursuit of high-density packaging
and reduced packaging costs, advanced flip-chip packaging technology has gradually replaced traditional wire bonding technology. Compared with traditional wire bonding technology, flip-chip packaging technology has the advantages of small package size, high-density I/O contacts, short connection lines, low noise, and good electrical effects
We are committed to delivering the best value to our clients by providing quality products and service ranging from:
PPE, HC, Crosslink, Flame Retardants, Additive, Auxiliary Materials
CCL, FCCL, Dry/ Release/ETFE/PET/ Carrier Films; WoW Sealing
WBG Power Modules, Memory Modules, BMS, Power Discrete
3D/ X-Ray Inspection, Exposure, Drilling, V-Cut, Corner Beveling, DES, Thermal
AGV/AMR/ Cobot, Manufacturing Automation System.