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- 烤爐種類: Dehydration-Bake, Pre-Bake, Post-Bake, HMDS
- 烤爐構成: HPCP (Hot plate / Cooling Plate) , 主要用於對基板表面的精密均一加熱,冷卻
- 主要應用LCD, TP產業
- 適用世代為G2~G10 基板Size
- HPCP的加熱/冷卻方式: 有接觸式/非接觸式兩種
- HPCP規格可依照User需求客製設計對應
Contact：
Hsinchu office 〡 許家哲 〡 03-6205899 Ext.23565 〡 aaron_hsu@wahlee.com
Hsinchu office 〡 王瑋綺 〡 03-6205899 Ext.23512 〡 ivywang@wahlee.com
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